In 2025, Apple will release the incredibly thin iPhone 17 Air, which will be the thinnest iPhone ever with a thickness of only 6.25mm

Alongside the iPhone 17, iPhone 17 Pro, and iPhone 17 Pro Max, Apple is anticipated to release a slimmer version of the iPhone. According to Mark Gurman’s weekly newsletter, this next model, which is said to be the iPhone 17 Air, will be roughly two millimeters thinner than the iPhone 16 Pro. Just a few months have passed since the release of the iPhone 16 series, but already we are receiving leaks and rumors about the upcoming iPhone 17 series, which is anticipated to make its appearance in Q4 2025.

For comparison, the thickness of the current iPhone 16 Pro is 8.25mm. The iPhone 17 Air will be the thinnest iPhone ever if it is 2 mm slimmer, which would make it roughly 6.25 mm. At 6.9mm, the iPhone 6 held the previous record. Beginning with the iPhone X, iPhones have generally gotten thicker over time to make room for bigger batteries, better cameras, Face ID, and other features.

According to some previous rumors, the iPhone 17 Air may be even smaller, measuring between 5 and 6 mm. Additionally, this supports rumors that the iPhone 17 Air may not even have a SIM tray. The majority of sources now predict that the phone will have a thickness of about 6 mm. The iPhone 17 Air is also anticipated to feature a single rear camera, a 6.6-inch display with a refresh rate of 120 Hz, and Apple’s own SoC, the A19, or whatever the firm decides to call it in 2025.

the Qualcomm chips that are now in use, this one is smaller. Gurman clarified that Apple saved space inside the phone by designing its modem chip to integrate more closely with its other hardware. Apple is able to make the iPhone 17 Air slimmer while maintaining the same level of battery life, camera quality, and display performance thanks to this additional space. Along with the iPhone 17 Air, Apple also intends to employ its proprietary modem chip in the low-cost iPad and the forthcoming iPhone SE, which is anticipated to ship in early 2025.

As Apple continues to improve its modem chip technology, the extra space created could make paving the path for inventions such as the foldable iPhone. Furthermore, this might occur sooner rather than later. According to Gurman, Apple is currently developing designs for foldable iPhones. Apple wants its semiconductors to progressively replace Qualcomm modems over the course of the next three years. Apple may eventually release a system-on-a-chip (SoC) that integrates the processor, modem, Wi-Fi, and more components. This strategy would maximize available space and facilitate improved hardware integration.

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